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  ?2006 fairchild semiconductor corporation fga50n100bntd rev. a www.fairchildsemi.com fga50n100bntd 10 00v, 50a npt-tren ch igbt co-pak fga50n100bntd 1000v, 50a npt-trench igbt co-pak general description trench insulated gate bipolar transistors (igbts) with npt technology show outstanding performance in conduction and switching characteristics as well as enhanced avalanche ruggedness. these dev ices are well suited for induction heating ( i-h ) applications features ? high speed switching ? low saturation voltage: v ce(sat) = 2.5v @ i c = 60a ? high input impedance ? built-in fast recovery diode absolute maximum ratings t c = 25 c unless otherwise noted symbol description fga50n100bntd units v ces collector-emitter voltage 1000 v v ges gate-emitter voltage 25 v i c collector current @ t c = 25 c 50 a collector current @ t c = 100 c 35 a i cm (1) pulsed collector current 100 a i f diode continuous forward current @ t c = 100 c 15 a p d m a x i m u m p o w e r d i s s i p a t i o n @ t c = 25 c 156 w maximum power dissipation @ t c = 100 c 63 w t j operating junction temperature -55 to +150 c t stg storage temperature range -55 to +150 c t l maximum lead temp. for soldering purposes, 1/8? from case for 5 seconds 300 c notes : (1) repetitive rating : pulse width limited by max. junction temperature thermal characteristics symbol parameter typ. max. units r jc (igbt) thermal resistance, junction-to-case -- 0.8 c / w r jc (diode) thermal resistance, junction-to-case -- 2.4 c / w r ja thermal resistance, junction-to-ambient -- 25 c / w application micro- wave oven, i-h cooker, i-h ja r, induction heater, home appliance g c e to-3p january 2006 c e g
www.fairchildsemi.com fga50n100bntd 10 00v, 50a npt-tren ch igbt co-pak fga50n100bntd rev. a package marking and ordering information device marking device package packaging type qty per tube max qty per box fga50n100bntd FGA50N100BNTDTU to-3p rail / tube 30ea - electrical characteristics of igbt t c = 25 c unless otherwise noted symbol parameter test conditions min. typ. max. units off characteristics bv ces collector emitter breakdown voltage v ge = 0v, i c = 1ma 1000 -- -- v i ces collector cut-off current v ce = 1000v, v ge = 0v -- -- 1.0 ma i ges g-e leakage current v ge = 25, v ce = 0v -- -- 500 na on characteristics v ge(th) g-e threshold voltage i c = 60ma, v ce = v ge 4.0 5.0 7.0 v v ce(sat) collector to emitter saturation voltage i c = 10a , v ge = 15v -- 1.5 1.8 v i c = 60a , v ge = 15v -- 2.5 2.9 v dynamic characteristics c ies input capacitance v ce =10v , v ge = 0v, f = 1mhz -- 6000 -- pf c oes output capacitance -- 260 -- pf c res reverse transfer capacitance -- 200 -- pf switching characteristics t d(on) turn-on delay time v cc = 600 v, i c = 60a, r g = 51 ? , v ge =15v, resistive load, t c = 25 c -- 140 -- ns t r rise time -- 320 -- ns t d(off) turn-off delay time -- 630 -- ns t f fall time -- 130 250 ns q g total gate charge v ce = 600 v, i c = 60a, v ge = 15v , , t c = 25 c -- 275 350 nc q ge gate-emitter charge -- 45 -- nc q gc gate-collector charge -- 95 -- nc electrical characteristics of diode t c = 25 c unless otherwise noted symbol parameter test conditions min. typ. max. units v fm diode forward voltage i f = 15a -- 1.2 1.7 v i f = 60a -- 1.8 2.1 v t rr diode reverse recovery time i f = 60a di/dt = 20 a/us 1.2 1.5 us i r instantaneous reverse current v rrm = 1000v -- 0.05 2 ua
www.fairchildsemi.com fga50n100bntd 10 00v, 50a npt-tren ch igbt co-pak fga50n100bntd rev. a 012345 0 20 40 60 80 100 20v 15v 10v 9v 8v 7v v ge = 6v common emitter t c = 25 o c collector current, i c [a] collector-emitter voltage, v ce [v] 01234 0 10 20 30 40 50 60 70 80 90 common emitter v ge = 15v tc = 25 o c tc = 125 o c collector current, i c [a] collector-emitter voltage, v ce [v] -50 0 50 100 150 1 2 3 i c =10a 30a 60a 80a common emitter v ge =15v collector-emitter voltage, v ce [v] case temperature, t c [ o c] 4 8 12 16 20 0 2 4 6 8 10 common emitter t c = - 40 o c i c =10a 80a 60a 30a collector-emitter voltage, v ce [v] gate-emitter voltage, v ge [v] 4 8 12 16 20 0 2 4 6 8 10 common emitter t c = 25 o c 80a 60a 30a i c = 10a collector-emitter voltage, v ce [v] gate-emitter voltage, v ge [v] 4 8 12 16 20 0 2 4 6 8 10 common emitter t c = 125 o c 80a 60a 30a i c = 10a collector-emitter voltage, v ce [v] gate-emitter voltage, v ge [v] fig 1. typical output characteristics fig 2. typical saturation voltage characteristics fig 4. saturation voltage vs. v ge fig 3. saturation voltage vs. case temperature at varient current level fig 5. saturation voltage vs. v ge fig 6. saturation voltage vs. v ge
www.fairchildsemi.com fga50n100bntd 10 00v, 50a npt-tren ch igbt co-pak fga50n100bntd rev. a 0 5 10 15 20 25 30 100 1000 10000 common emitter v ge = 0v, f = 1mhz t c = 25 o c cres coes cies capacitance [pf] collector-emitter voltage, v ce [v] 0 50 100 150 200 10 100 1000 10000 v cc =600v, i c =60a v ge = +/-15v t c =25 o c tdoff tdon tr tf switching time [ns] gate resistance, r g [ : ] 10 20 30 40 50 60 100 1000 v cc =600v, rg=51 : v ge =+/-15v, t c =25 o c tdon tr tf tdoff switching time [ns] collector current, i c [a ] 0 50 100 150 200 250 300 0 5 10 15 20 common emitter v cc =600v, r l =10 : t c =25 o c gate-emitter voltage,v ge [v] gate charge, q g [nc] fig 7. capacitance characteristics fig 8. switching characteristics vs. gate resistance fig 9. switching ch aracteristics vs. collector current fig 10. gate charge characteristics fig 11. soa characteristics fig 12. transient thermal impedance of igbt 1e-5 1e-4 1e-3 0.01 0.1 1 10 1e-3 0.01 0.1 1 rectangul ar pul se durati on [sec] thermal response [zthjc] 0.5 0.2 0.1 0.05 0. 02 0.01 single pulse 0.1 1 10 100 1000 0.01 0.1 1 10 100 50 p s 100 p s 1ms dc operation ic max (pulsed) ic max (continuous) single nonrepetitive pulse tc = 25 o c curves must be derated linearly with increase in temperature collector current, ic [a] collector - emitter voltage, v ce [v]
www.fairchildsemi.com fga50n100bntd 10 00v, 50a npt-tren ch igbt co-pak fga50n100bntd rev. a fig 17. junction capacitance 0.1 1 10 100 0.0 0.5 1.0 1.5 2.0 2.5 t c = 25 o c t c = 100 o c forward voltage, v fm [v] forward current, i f [a] 0 40 80 120 160 200 240 0.0 0.2 0.4 0.6 0.8 1.0 1.2 i rr t rr i f = 60 a t c = 25 o c di/dt [a/us] reverse recovery time, t rr [us] 0 20 40 60 80 100 120 reverse recovery current i rr [a] 10 20 30 40 50 60 0.4 0.6 0.8 1.0 1.2 i rr t rr forward current, i f [a] reverse recovery time, t rr [us] 4 6 8 10 12 di/dt=-20a/us t c =25 o c reverse recovery current i rr [a] 0 300 600 900 1e-3 0.01 0.1 1 10 100 1000 t c = 150 o c t c = 25 o c reverse current, i r [ua] reverse voltage, v r [v] 0.1 1 10 100 0 50 100 150 200 250 t c = 25 o c capacitance, c j [pf] reverse voltage, v r [v] fig 14. reverse recovery characteristics vs. di/dt fig 13. forward characteristics fig 15. reverse recovery characteristics vs. forward current fig 16. reverse current vs. reverse voltage
fga50n100bntd rev. a www.fairchildsemi.com fga50n100bntd 10 00v, 50a npt-tren ch igbt co-pak package dimension to-3p 15.60 0.20 4.80 0.20 13.60 0.20 9.60 0.20 2.00 0.20 3.00 0.20 1.00 0.20 1.40 0.20 ?3.20 0.10 3.80 0.20 13.90 0.20 3.50 0.20 16.50 0.30 12.76 0.20 19.90 0.20 23.40 0.20 18.70 0.20 1.50 +0.15 ?0.05 0.60 +0.15  ?0.05 5.45typ [5.45 0.30 ] 5.45typ [5.45 0.30 ] dimensions in millimeters
fga50n100bntd rev. a www.fairchildsemi.com trademarks the following are registered and unregistered trademarks fairch ild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, functi on or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under it s patent rights, nor the rights of others. life suppo rt policy fairchild?s products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or s ystems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.  2. a critical component is any component of a life support device or system whose failur e to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.  product status definitions definition of terms acex? activearray? bottomless? build it now? coolfet? crossvolt ? dome? ecospark? e 2 cmos? ensigna? fact? fact quiet series? fast ? fastr? fps? frfet? globaloptoisolator? gto? hisec? i 2 c? i-lo ? implieddisconnect ? intellimax? isoplanar? littlefet? microcoupler? microfet? micropak? microwire? msx ? msxpro ? ocx ? ocxpro ? optologic ? optoplanar? pacman? pop? power247? poweredge? powersaver? powertrench ? qfet ? qs? qt optoelectronics? quiet series? rapidconfigure ? rapidconnect ? serdes ? scalarpump ? silent switcher ? smart start? spm? stealth? superfet? supersot?-3 supersot?-6 supersot?-8 syncfet? tinylogic ? tinyopto? trutranslation? uhc? ultrafet ? unifet? vcx? wire? across the board. around the world. ? the power franchise ? programmable active droop? datasheet identification product status definition advance information formative or in design this datasheet contains the design specifications for product development. spec ifications may change in any manner without notice. preliminary first production this datas heet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. no identification needed full production this datas heet contains final spec ifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design.  obsolete not in production this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. rev. i17 fga50n100bntd 10 00v, 50a npt-tren ch igbt co-pak
careers | sitema go datasheets, samples, buy technical information applications design center support company investors my f a home >> find products >> product status/pricing/packaging fga50n100bntd 1000v, 50a npt-trench igbt co-pak general description back to top features back to top applications back to top contents ? general description ? features ? applications ? product status/pricing/packaging ? order samples ? qualification support trench insulated gate bipolar tran sistors (igbts) with npt technology show outstanding performance in cond uction and switching characteristics as well as enhanced avalanche ruggedness. these devices are well suited for induction heating ( i-h ) applications z high speed switching z low saturation voltage: v ce(sat) = 2.5v @ i c = 60a z high input impedance z built-in fast recovery diode micro- wave oven, i-h cooker, i-h jar, induction heater, home appliance datasheet download this datasheet e - mail this datasheet this page print version product product status pb-free status pricing* package type leads packing method package marking convention** related links request samples how to order products product change notices (pcns) support sales support quality and reliability design cente r pa g e 1 of 2 product folder - fairchild p/n fga50n100bntd - 1000v, 50a npt-trench igbt co-pa k 17-au g -2007 mhtml:file://c:\temp \FGA50N100BNTDTU.mht
back to top qualification support click on a product for detailed qualification data back to top FGA50N100BNTDTU full production $3.88 to - 3p 3 rail line 1: $y (fairchild logo) line 2: fga50n100 line 3: bntd&e&3 * fairchild 1,000 piece budgetary pricing ** a sample button will appear if the part is available through fa irchild's on-line samples program. if there is no sample butt on, please contact a fairchild distributor to obtain samples indicates product with pb -free second-level interconne ct. for more information click here. package marking information for product fga50n100bntd is available. click here for more information . product FGA50N100BNTDTU ? 2007 fairchild semiconductor products | design center | support | company news | investors | my fairchild | contact us | site index | privacy policy | site terms & conditions | standard terms & conditions o pa g e 2 of 2 product folder - fairchild p/n fga50n100bntd - 1000v, 50a npt-trench igbt co-pa k 17-au g -2007 mhtml:file://c:\temp \FGA50N100BNTDTU.mht


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